Dr. Tengfei Jiang
Department: Department of Materials Science and Engineering
Position at UCF:
E-mail: tengfei.jiang@ucf.edu
Campus Location: Orlando (Main Campus)
Project Title: Materials Reliability for Advanced Microelectronics Packaging
Project Description:

Our group investigates how the properties and behaviors of materials impact the reliability of advanced microelectronics packaging solutions, such as 3D integration. This project involves characterizing material behaviors by techniques such as Atomic Force Microscopy (AFM), double cantilever beam (DCB), and 4-point bend measurements. Students will learn about the latest interconnect and packaging technologies in the microelectronics industry, such as through-silicon via (TSV) based three dimensiol integration. https://en.wikipedia.org/wiki/Through-silicon_via. Students will also receive basic training in materials characterization and alysis. You are welcome to check our website or send us emails if you have any questions about the project.

Student Responsibilities: Basic engineering training. Drawing in CAD or similar tools. Basic labview skillsFinite element alysis is a plus.
Student Requirements: Student will assist graduate students in materials characterization and alysis by AFM, DCB, and 4pt bend. Student will also be involved in setting up measurement systems, which may involve coding in labview, CAD drawing, and trouble shooting the systems under the guidance of graduate students. The hour of work is relatively flexible and can be worked out with the PI.The starting and ending dates of the project are also flexible and can be discussed.
Type of Project: Individual
Possibility of Payment: Yes
Number of Students: 2

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